Progress of Research in Slicing Technology of Large-Scale Silicon Wafers

Abstract:

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This paper introduces and summarizes the slicing technology of large-scare silicon wafers. And the research status of ID slicing, wire saw slicing and WEDM is summed up. Finally, this document indicates the direction of research and the development.

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Periodical:

Key Engineering Materials (Volumes 375-376)

Edited by:

Yingxue Yao, Xipeng Xu and Dunwen Zuo

Pages:

1-5

DOI:

10.4028/www.scientific.net/KEM.375-376.1

Citation:

L. G. Zhao et al., "Progress of Research in Slicing Technology of Large-Scale Silicon Wafers", Key Engineering Materials, Vols. 375-376, pp. 1-5, 2008

Online since:

March 2008

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Price:

$35.00

[1] Z.J. Pei: International Journal of Machine Tools & Manufacture, Vol. 42 (2002), pp.385-393.

[2] M.A. Chun: Shanghai : Nonferrous Metals , Vol. 26 (2005) No. 3, pp.145-148.

[3] Anonymous: World Manufacturing Engineering & Market, Vol. 5 (2004), p.36(In Chinese).

[4] P.Q. Ge, J.F. Meng, J.H. Chen and et al: Tool Engineering, Vol. 39 (2005), pp.3-6 (In Chinese).

[5] B.C. Chong: Equipment For Electronic Products Manufacturing, Vol. 31 (2002) No. 3, pp.156-158 (In Chinese).

[6] R.X. Fan and H.M. Hu: Materials Science and Engineering, Vol. 17 (1999) No. 2, pp.55-57 (In Chinese).

[7] R.K. Kang, Y.B. Tian, D.M. Guo and et al: Diamond & Abrasives Engineering, Vol. 4 (2003), pp.13-18(In Chinese).

[8] I. Kao, V. Prasad, J. Li and et al: Proceedings of the 1997 NSF. Design & Manufacturing Grantees Conference. pp.239-240.

[9] W.I. Clark, A.J. Shih, C.W. Hardin and et al: International Journal Machine Tools & Manufacture, Vol. 43 (2003), pp.523-532.

[1] M.R. Chang: Semiconductor Technology, Vol. 31 (2006) No. 6, pp.176-179 (In Chinese).

[11] M.B. Smith, F. Schmid and C.P. Khattak: US Patent, No. 4384564 (1983).

[12] F. Schmid, C.P. Khattak and M.B. Smith: US Patent No. 4727852 (1988).

[13] F. Schmid, and M.B. Smith: US Patent No. 5842462 (1998).

[14] F. Schmid, M.B. Smith and C.P. Khattak: US Patent No. 5438973 (1995).

[15] C.S. Hardin: Fixed - Abrasive Diamond Wire Saw Slicing of Single Crystal SiC Wafers and Wood ( MS. North California State University, USA 2003).

DOI: 10.1115/imece2003-41836

[16] F. Schmid, C.P. Khattak, M.B. Smith and L.D. Lynch: Fourth E.C. Photovoltaic Solar Energy Conference. Proceedings of the International Conference, 1982, pp.980-984.

[17] P.Q. Ge, L. Zhang, W. Gao and Z.C. Liu: Materials Science Forum, Vols. 471-472 (2004), pp.481-484 (In Chinese).

[18] W. Gao and Y. Liu: Diamond & Abrasives Engineering, Vol. 150 (2005) No. 6: pp.54-61 (In Chinese).

[19] A. Okada, Y. Uno, Y. Okamoto and et al.: International Journal of Electrical Machining, (2003) No. 8, pp.21-26.

[20] T. Hideo, I. Toshimitsu and et al: Precision Engineering, Vol. 8 (2003), pp.314-319.

[21] T. Hideo, I. Toshimitsu and et al: Precision Engineering, Vol. 29 (2005), pp.423-430.

[22] W.Y. Peng: Journal of Materials Processing Technology, Vol. 140 (2003), pp.274-279.

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