Progress of Research in Slicing Technology of Large-Scale Silicon Wafers
This paper introduces and summarizes the slicing technology of large-scare silicon wafers. And the research status of ID slicing, wire saw slicing and WEDM is summed up. Finally, this document indicates the direction of research and the development.
Yingxue Yao, Xipeng Xu and Dunwen Zuo
L. G. Zhao, D. W. Zuo, Y. L. Sun, "Progress of Research in Slicing Technology of Large-Scale Silicon Wafers", Key Engineering Materials, Vols. 375-376, pp. 1-5, 2008