Progress of Research in Slicing Technology of Large-Scale Silicon Wafers


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This paper introduces and summarizes the slicing technology of large-scare silicon wafers. And the research status of ID slicing, wire saw slicing and WEDM is summed up. Finally, this document indicates the direction of research and the development.



Key Engineering Materials (Volumes 375-376)

Edited by:

Yingxue Yao, Xipeng Xu and Dunwen Zuo




L. G. Zhao et al., "Progress of Research in Slicing Technology of Large-Scale Silicon Wafers", Key Engineering Materials, Vols. 375-376, pp. 1-5, 2008

Online since:

March 2008




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