Progress of Research in Slicing Technology of Large-Scale Silicon Wafers

Abstract:

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This paper introduces and summarizes the slicing technology of large-scare silicon wafers. And the research status of ID slicing, wire saw slicing and WEDM is summed up. Finally, this document indicates the direction of research and the development.

Info:

Periodical:

Key Engineering Materials (Volumes 375-376)

Edited by:

Yingxue Yao, Xipeng Xu and Dunwen Zuo

Pages:

1-5

DOI:

10.4028/www.scientific.net/KEM.375-376.1

Citation:

L. G. Zhao, D. W. Zuo, Y. L. Sun, "Progress of Research in Slicing Technology of Large-Scale Silicon Wafers", Key Engineering Materials, Vols. 375-376, pp. 1-5, 2008

Online since:

March 2008

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Price:

$35.00

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