Effects of Conditioning Parameters on Pad Performances

Abstract:

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This paper studied the effects of the off-process conditioning parameters on the pad performances. The pad conditioning was evaluated based on the measurement of pad removal rate, the observation of the conditioned pad surface. The performances of conditioned pads were evaluated also by the material removal rate (MRR) and the surface roughness of polished wafers in the CMP experiments of LiTaO3 crystal wafers.

Info:

Periodical:

Key Engineering Materials (Volumes 375-376)

Edited by:

Yingxue Yao, Xipeng Xu and Dunwen Zuo

Pages:

293-297

DOI:

10.4028/www.scientific.net/KEM.375-376.293

Citation:

X. Wei et al., "Effects of Conditioning Parameters on Pad Performances", Key Engineering Materials, Vols. 375-376, pp. 293-297, 2008

Online since:

March 2008

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Price:

$35.00

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