Effects of Conditioning Parameters on Pad Performances


Article Preview

This paper studied the effects of the off-process conditioning parameters on the pad performances. The pad conditioning was evaluated based on the measurement of pad removal rate, the observation of the conditioned pad surface. The performances of conditioned pads were evaluated also by the material removal rate (MRR) and the surface roughness of polished wafers in the CMP experiments of LiTaO3 crystal wafers.



Key Engineering Materials (Volumes 375-376)

Edited by:

Yingxue Yao, Xipeng Xu and Dunwen Zuo




X. Wei et al., "Effects of Conditioning Parameters on Pad Performances", Key Engineering Materials, Vols. 375-376, pp. 293-297, 2008

Online since:

March 2008




[1] M. Bubnick, S. Qamar, S. McGregor and et al: Abrasive Technology, (2004).

[2] B.J. Hooper and et al: Journal of Materials Processing Technology, Vol. 123 (2002), p.107.

[3] http: /www. mirl. itri. org. tw/mirl-inter/knowledge/mim/254/254-06. pdf.

[4] K. Achuthan: Evaluation and Characterization of Polyurethane Chemical Mechanical Planari -zation Polishing Pads. (Ph.D. Dissertation, Clarkson University 1998).

[5] Y.Y. Zhou and et al: Materials Science and Engineering, Vol. B68 (1999), p.91.

[6] X.H. Wu: Study of Properties and Their Effects on Polishing Efficiency and Surface Quality in Chemical Mechanical Polishing (MS. Dissertation, Dalian University of Technology 2005). (In Chinese).