The Thermoelectromechanical J-Integral and the Thermal Permeability of Cracks

Abstract:

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The J-integral for cracks in structures storing elastic, dielectric and thermal energies is derived from thermodynamical fundamentals. The FEM is applied to solve thermoelectrome- chanical boundary value problems, accounting for piezoelectric coupling, thermoelasticity and the pyroelectric effect. Examples demonstrate the influence of the thermal conductivity of cracks on the loading of the crack tip.

Info:

Periodical:

Key Engineering Materials (Volumes 385-387)

Edited by:

H.S. Lee, I.S. Yoon and M.H. Aliabadi

Pages:

569-572

DOI:

10.4028/www.scientific.net/KEM.385-387.569

Citation:

A. Ricoeur and M. Kuna, "The Thermoelectromechanical J-Integral and the Thermal Permeability of Cracks", Key Engineering Materials, Vols. 385-387, pp. 569-572, 2008

Online since:

July 2008

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Price:

$35.00

[1] M. Kuna, in: IUTAM Symposium on Mechanics and Reliability of Actuating Materials, ed. by W. Yang, Springer, 131-143 (2006).

[2] T.H. Hao and Z.Y. Shen: Engineering Fracture Mechanics Vol. 47 (1994), p.793.

[3] A. Ricoeur, M. Enderlein and M. Kuna: Archive of Applied Mechanics 74 (2005), p.536.

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