Study on Glass Strength at High Speed Edge Rounding for LCD


Article Preview

With increasing in size of glass substrates for flat panel, both high productivity and high quality are required for its edge rounding process. In order to understand the effect of process speed on the strength of glass substrate, this study performs a profile grinding at the substrate edge with varied feed rate. The obtained glass substrate then undergoes a four-point bending to evaluate its strength. Weibull distribution is used to analyze the fracture strength of glass substrate after edge-rounding process and to correlate the removal rate with the quality of the process.



Key Engineering Materials (Volumes 389-390)

Edited by:

Tsunemoto Kuriyagawa, Libo Zhou, Jiwang Yan and Nobuhito Yoshihara




N. Suzuki and T. Halai, "Study on Glass Strength at High Speed Edge Rounding for LCD", Key Engineering Materials, Vols. 389-390, pp. 448-452, 2009

Online since:

September 2008




[1] H. Kobayashi: Fracture mechanics (Kyouritu Publisher, Japan 1993).

[2] O. Imanaka: Handbook on Ceramics working (Nikkan Kougyou Newspaper Publisher, Japan 1987).

[3] K. Ohashi: Mechanism of Fracture (Maruzen. Co., Ltd, Japan 1987).

[4] H. Awaji: Strength of Ceramic Materials (Corona Publishing Co., Ltd., Japan 2001).

[5] Materials Science Society of Japan: Materials and Fracture (Shokabo, Japan 1989).

[6] N. Suzuki and M. Saitoh: Collection of papers in ABTEC2007(2007), pp.119-122.

[7] information on http: /www. corning. com/displaytechnologies.

Fetching data from Crossref.
This may take some time to load.