Effect of Polishing Time and Pressure on Polishing Pad Performance

Abstract:

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This paper experimentally investigates the effect of time and pressure on the condition of polishing pads and the material removal rate (MRR) of single crystal silicon. It was found that as the pad deteriorates with time, MRR decreases. Surfaces with a required quality can only be achieved before the texture deterioration reaches a critical limit. At a higher pressure, 25 kPa, deterioration is slower, and the effective life of pads and MRR is enhanced.

Info:

Periodical:

Key Engineering Materials (Volumes 389-390)

Edited by:

Tsunemoto Kuriyagawa, Libo Zhou, Jiwang Yan and Nobuhito Yoshihara

Pages:

510-514

DOI:

10.4028/www.scientific.net/KEM.389-390.510

Citation:

A.Q. Biddut et al., "Effect of Polishing Time and Pressure on Polishing Pad Performance", Key Engineering Materials, Vols. 389-390, pp. 510-514, 2009

Online since:

September 2008

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Price:

$35.00

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