Advances in Abrasive Technology XI

Volumes 389-390

doi: 10.4028/

Paper Title Page

Authors: Zhong De Shi, Madhusudhan Srinivasaraghavan, Helmi Attia

Abstract: A novel method is reported for predicting the distribution of normal and tangential grinding forces in wheel and workpiece contact zone or...

Authors: Zhi Gang Dong, Ren Ke Kang, Zhen Yuan Jia

Abstract: Single crystal MgO can be used as the substrates to deposit HTS films. The subsurface damage (SSD) generated in processing has great effect...

Authors: J. Sasaki, T. Tsuruga, B.H. Soltani, Takahito Mitsuta, Y.B. Tian, Jun Shimizu, Li Bo Zhou, Hiroshi Eda, Y. Tashiro, Hisao Iwase, Sumio Kamiya

Abstract: Silicon wafer thinning process is meeting great challenges to fulfill requirements of ultra-thin IGBT for automotive applications....

Authors: Jian Qiang Guo, Hitoshi Ohmori, Kazutoshi Katahira, Yoshihiro Uehara

Abstract: Ceramics has many advantages that cannot be substituted by metals, but its machining induced defects, such as crack and crater, are the...

Authors: H.P. Yuan, Hang Gao, Yong Jie Bao, Yong Bo Wu

Abstract: Aiming at solving the problems of wheel loading in dry grinding of Carbon/Epoxy composite materials, a novel electroplated grinding wheel...

Authors: Junichi Tamaki, Akihiko Kubo, Ji Wang Yan

Abstract: The elastic and/or plastic behaviors of glass quartz, the most popular optical material and a hard and brittle material, were studied...

Authors: Feng Wei Huo, Dong Ming Guo, Ren Ke Kang, Zhu Ji Jin

Abstract: A 3D profiler based on scanning white light interferometry with a lateral sampling interval of 0.11μm was introduced to measure the surface...


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