Advances in Abrasive Technology XI
Volume is indexed by Thomson Reuters CPCI-S (WoS).
Abrasive technology concerns manufacturing processes that involve the use of abrasives in various forms. It has a long history; originating right from the first discovery of minerals. With increasingly stringent requirements for the production of high-precision and high surface-quality components, in applications such as silicon wafers for the semiconductor industry and optical lenses for the precision instrument industry, abrasive technology is becoming an increasingly important factor in precision manufacturing. An understanding of the mechanisms of abrasive technology ensures the soundness and integrity of current component manufacture, as well as leading to the development of new and effective techniques.
This volume comprises a collection of 88 selected papers, contributed by experts from all over the world and subjected to rigorous peer-review and revision in order to ensure originality and quality. The topics covered include new developments and applications in grinding, polishing, CMP, silicon-wafer processing and field-assisted abrasive machining technologies, plus novel techniques and new insights into dressing and truing for grinding processes and, in addition, abrasive-jet processing. It also covers further topics which are relevant to precision manufacturing: including the nano-processing of brittle materials, precision measurements and evaluation of high-precision components, micro-fabrication, and advanced machining technologies such as ecological and high-speed machining.
This book therefore provides an invaluable up-to-date reference work for researchers in the abrasive technology field who wish to understand, in depth, the underlying mechanisms and to create new and practical technologies, systems and processes. It will also be particularly useful for practising engineers in precision manufacturing who are responsible for maintaining efficient and effective operations.
Review from Ringgold Inc., ProtoView: Abrasive technology is important in precision manufacturing applications such as silicon wafers and optical lenses. This volume collects 88 peer-reviewed papers in the field, by experts from around the world. The topics covered include new developments and applications in grinding, polishing, and abrasive machining technologies, plus novel techniques in dressing and truing for grinding processes and abrasive-jet processing. Other topics covered relevant to precision manufacturing include the nano-processing of brittle materials, precision measurements and evaluation of high-precision components, micro-fabrication, and advanced machining technologies such as ecological and high-speed machining. B&w images are included. The book will be useful as a reference for researchers in abrasive technology, and for practicing engineers in precision manufacturing. Kuriyagawa is affiliated with Tohoku University, Japan.