Study for Laser Cladding of Ni60A on Copper Substrate by Laser

Abstract:

Article Preview

The Ni60A powder was clad on the copper by the laser through coaxial power feeding. The hardness and erosion resistance of the substrate and the cladding layer were measured and made contrasts. The morphology and the microstructures of the cladding layer were analyzed by scanning electronic microscopy as well as the microstructure of bonding interface. The contents of major elements in the bonding interface were studied by energy dispersive spectrometer. Moreover, large amount of (Cu and Ni) solid solution formed a metallurgic and tight bonding with the good dilution between the substrate and cladding layer.

Info:

Periodical:

Key Engineering Materials (Volumes 392-394)

Edited by:

Guanglin Wang, Huifeng Wang and Jun Liu

Pages:

125-130

DOI:

10.4028/www.scientific.net/KEM.392-394.125

Citation:

F. J. Tian et al., "Study for Laser Cladding of Ni60A on Copper Substrate by Laser", Key Engineering Materials, Vols. 392-394, pp. 125-130, 2009

Online since:

October 2008

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.