Motion Analysis of Ball Grinder with Dual-Rotating Plates Lapping Mode

Abstract:

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Dual-rotating plates lapping method is a new type of ball machining technology, in which the spin axis angle of the ball could wiggle up to 180°. An investigation was made to verify the motion model of the dual-rotating plates lapping. The ball motion parameters, such as revolution speed, spin speed and spin axis angle were detected experimentally. The results show that the calculated values and the measured ones of the ball motion parameters are almost identical. The motion model of the dual-rotating plates lapping method is thus verified valid.

Info:

Periodical:

Edited by:

Bo Zhao, Xipeng Xu, Guangqi Cai and Renke Kang

Pages:

295-299

DOI:

10.4028/www.scientific.net/KEM.416.295

Citation:

Y. F. Jin et al., "Motion Analysis of Ball Grinder with Dual-Rotating Plates Lapping Mode", Key Engineering Materials, Vol. 416, pp. 295-299, 2009

Online since:

September 2009

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Price:

$35.00

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