Vacuum Micro-Electroforming Technique for the Production of Void-Free Microcomponent

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Pinhole defect in the deposit is one of the ticklers which have not yet been solved fundamentally when micro-electroforming nickel into high-aspect-ratio (HAR) micro-molds. To obtain void-free micro-components, a new micro-electroforming technique, which was carried out under the complex circumstance of vacuum-degassing and temperature-gradient, was developed in this paper. Mechanisms of this micro-electroforming process were introduced using graphic and simulation methods. To investigate the feasibility of the exploited technique, a series of experiments were performed using special equipment developed by authors, followed by the evaluating of surface morphology of nickel micro-electroforms using a scanning electron microscope (SEM). Experimental results showed that, comparing with the conventional electroforming practices, a significant reduction in pinhole defects of the samples electroformed by the novel process was achieved.

Info:

Periodical:

Key Engineering Materials (Volumes 426-427)

Edited by:

Dunwen Zuo, Hun Guo, Guoxing Tang, Weidong Jin, Chunjie Liu and Chun Su

Pages:

142-146

DOI:

10.4028/www.scientific.net/KEM.426-427.142

Citation:

P. M. Ming et al., "Vacuum Micro-Electroforming Technique for the Production of Void-Free Microcomponent", Key Engineering Materials, Vols. 426-427, pp. 142-146, 2010

Online since:

January 2010

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Price:

$38.00

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