Vacuum Micro-Electroforming Technique for the Production of Void-Free Microcomponent
Pinhole defect in the deposit is one of the ticklers which have not yet been solved fundamentally when micro-electroforming nickel into high-aspect-ratio (HAR) micro-molds. To obtain void-free micro-components, a new micro-electroforming technique, which was carried out under the complex circumstance of vacuum-degassing and temperature-gradient, was developed in this paper. Mechanisms of this micro-electroforming process were introduced using graphic and simulation methods. To investigate the feasibility of the exploited technique, a series of experiments were performed using special equipment developed by authors, followed by the evaluating of surface morphology of nickel micro-electroforms using a scanning electron microscope (SEM). Experimental results showed that, comparing with the conventional electroforming practices, a significant reduction in pinhole defects of the samples electroformed by the novel process was achieved.
Dunwen Zuo, Hun Guo, Guoxing Tang, Weidong Jin, Chunjie Liu and Chun Su
P. M. Ming et al., "Vacuum Micro-Electroforming Technique for the Production of Void-Free Microcomponent", Key Engineering Materials, Vols. 426-427, pp. 142-146, 2010