Modeling of Polishing Pad Wear in Chemical Mechanical Polishing

Abstract:

Article Preview

The polishing pad’s wear influences the surface accuracy of the polished wafer. A new polishing pad wear model is established using the idea of Finite Element Analysis (FEA) and the effect of polishing parameters on the wear of polishing pad is discussed.

Info:

Periodical:

Key Engineering Materials (Volumes 431-432)

Edited by:

Yingxue Yao, Dunwen Zuo and Xipeng Xu

Pages:

318-321

DOI:

10.4028/www.scientific.net/KEM.431-432.318

Citation:

M. Li et al., "Modeling of Polishing Pad Wear in Chemical Mechanical Polishing", Key Engineering Materials, Vols. 431-432, pp. 318-321, 2010

Online since:

March 2010

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Price:

$35.00

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