Modeling of Polishing Pad Wear in Chemical Mechanical Polishing


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The polishing pad’s wear influences the surface accuracy of the polished wafer. A new polishing pad wear model is established using the idea of Finite Element Analysis (FEA) and the effect of polishing parameters on the wear of polishing pad is discussed.



Key Engineering Materials (Volumes 431-432)

Edited by:

Yingxue Yao, Dunwen Zuo and Xipeng Xu




M. Li et al., "Modeling of Polishing Pad Wear in Chemical Mechanical Polishing", Key Engineering Materials, Vols. 431-432, pp. 318-321, 2010

Online since:

March 2010




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