Evaluation of Component Reliability Using Data Derived from Infrared Thermography

Abstract:

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Condition monitoring of components is commonly required to evaluate integrity, manage maintenance and predict impending failure. The condition of many electrical and mechanical components is revealed by their thermal signature which can be reliably monitored by infrared camera. Thermal data obtained optically has the advantage of being non-contact so that moving mechanical parts and high voltage electrical components, including those located in hazardous environments or with difficult access, can be readily monitored. This paper proposes that data obtained by such methods is processed within a model in order to identify the imminent failure of a component or to estimate the probability that a component may exceed its operating tolerances at any given time within the remainder of its expected life.

Info:

Periodical:

Edited by:

Daizhong Su, Qingbin Zhang and Shifan Zhu

Pages:

275-278

DOI:

10.4028/www.scientific.net/KEM.450.275

Citation:

J. Redgate et al., "Evaluation of Component Reliability Using Data Derived from Infrared Thermography ", Key Engineering Materials, Vol. 450, pp. 275-278, 2011

Online since:

November 2010

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Price:

$35.00

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