Fatigue Testing of Thin Films

Abstract:

Article Preview

Thin film processing has been a driving technology in microelectronics and mechanics for years. The reliability of such devices is often limited by the failure of thin films. Therefore a deeper understanding of fatigue mechanisms of thin films through experiments is necessary to develop physical based lifetime models. Thus, this paper focuses on a novel setup for micro beam bending of thin metal films on Si cantilever substrate and first results will be presented.

Info:

Periodical:

Edited by:

Pavel Šandera

Pages:

552-555

DOI:

10.4028/www.scientific.net/KEM.465.552

Citation:

S. Burger et al., "Fatigue Testing of Thin Films", Key Engineering Materials, Vol. 465, pp. 552-555, 2011

Online since:

January 2011

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Price:

$35.00

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