Tensile and Thermal Conductivity Properties of Epoxy Nanocomposites Thin Film by Spin Coating Technique


Article Preview

This work aims to enhance thermal conductivity of thin film without compromising the other properties of polymer. In this study, three types of fillers in nano size with high thermal conductivity properties were studied; silicon nitride, boron nitride and synthetic diamond. The contents of fillers were varied between 0-2 vol. %. Epoxy nano-composite solution filled with high thermal conductivity fillers was spun at 1500-2000 rpm to produce thin film in the thickness of 40-60 µm. Thermal conductivity properties were measured by using hot disc technique. It was found that the thermal conductivity increases as filler loading increases. The mechanical properties of the thin film epoxy composites were determined by using tensile test (ASTM D882). As predicted, the tensile modulus was found increasing with the addition of fillers and reasonable agreements were obtained from the SEM images of the fracture surfaces.



Key Engineering Materials (Volumes 471-472)

Edited by:

S.M. Sapuan, F. Mustapha, D.L. Majid, Z. Leman, A.H.M. Ariff, M.K.A. Ariffin, M.Y.M. Zuhri, M.R. Ishak and J. Sahari




T.V. Voo et al., "Tensile and Thermal Conductivity Properties of Epoxy Nanocomposites Thin Film by Spin Coating Technique", Key Engineering Materials, Vols. 471-472, pp. 1118-1123, 2011

Online since:

February 2011




[1] W. Menz, J. Mohr, O. Paul, Microsystem Technology, Wiley-VCH, Weinheim1, (2001).

[2] Kiyotaka Wasa, Makoto Kitabatake, Hideaki Adachi,. Thin Film Matarials Technology, Wiliam Andrew publishing, (2004).

DOI: https://doi.org/10.1016/b978-081551483-1.50004-6

[3] Richard P. Vince, Joost J. Vlassak, , Annu. Rev. Mater. Sci. (1996), 26: 431-62.

[4] James Rickman, Centrifugal Process Improves Thin Film, Los Alamos, N.M., 29, (2001).

[5] C.L. Haynes, A.D. MacFarland, M.T. Smith, J.C. Hulteen, R.P. Van Duyne, , J. Phys. Chem. B 106 (2002) 1898–(1902).

[6] T. Okubo, S. Chujo, S. Maenosono, Y. Yamaguchi, J. Nanopart. Res. 5 (2003) 111–117.

[7] J.S. Ahn, P.T. Hammond, M.F. Rubner, I. Lee, , Colloid Surf. A-Physicochem. Eng. Aspects 259 (2005) 45–53.

[8] Takashi Ogi, Luis Balam Modesto-Lopez, Ferry Iskandar, Kikuo Okuyama, , Colloids and Surface A: Physicocehm. Eng. Apspects 297 (2007) 71-78.

DOI: https://doi.org/10.1016/j.colsurfa.2006.10.027

[9] Emslie, A.G., Bonner, F.T., Peck, L.G.,. Journal of Applied Physics (1958): 29 (5), 858–862.

[10] Hall, D.B., Underhill, P., Torkelson, J.M.,. Polymer Engineering and Science (1998), 38 (12), 2039–(2045).

[11] Scriven, L.E. Physics and applications of dip coating and spin coating. Materials Research Society Symposium Proceedings (1988) 121, 717–729.

[12] Larson, R.G., Rehg, T.J., Spin coating. In: Kistler, S.F., Schweizer, P.M. (Eds. ), Liquid Film Coating: Scientific Principles and Their Technological Implications. Chapman & Hall, London (1997), p.673–708.

[13] Hirao, K., Watari, K., Hayashi, H., and Kitayama, K., MRS Bull., (2001) 26(6), pp.451-455.

[14] Karl E. Spear, John P. Dismukes, Synthetic Diamond: Emerging CVD Science and Technology, John Wiley and Sons, INC. (1994) p.314.

[15] Lee, H.; Neville, K. Handbook of Epoxy Resins; McGraw Hill: New York. (1982).

[16] C. P Wong and Raja S. Bollampally, International Symposium on Advanced Packaging Materials, (1999).

[17] Shenderov OA, Gruen DM, Ultrananocrystalline diamond: synthesis, properties, and applications. New York: William Andrew Publishing, (2006).

[18] Bharat Bhusnan, Springer handbook of nanotechnology, 2nd Edition, New York: Springer, (2006), p.1699.

[19] R.E. Smallman, R. J. Bishop. Physical Metallurgy and Materials Engineering: Science, Process, Applications. Elsevier Science Ltd, London, England. (1999) 6th Edition, p.326.

[20] Wypych G. Handbook of Fillers, . 2nd edi., Vol. 131. Toronto, New York; Ont.: Chem Tec. p. (2000) 241-75, 347-58.

[21] Y. W. Leong. M. B. Abu Bakar, Z. A. Mohd Ishak, A. Ariffin, B. Pukanszky, J. Appl. Poly. Sci., (2004) 91, 3315.

[22] Zhao Y-Q et. al. Composites: Part B. (2010).

[23] Wu, C. L., Zhang, M. Q., Rong, M. Z. and Friedrich, K, Composites Science and Technology, (2002) 62: 1327-1340.

[24] Gojny F. H. Wichmann M H G, PKE U K, Fiedler B, Schulte K. J. Composites Science and Technology, (2004) 15 (64): 2363-2371.

[25] Ren Yu, Li fend, Cheng H-M, et al. 2003. J. Carbon, (2003) 41 (11) 2177- 2179.

[26] Park J M, Kim D S, Lee J R, Kim T W. J. Mater. Sci. Eng. C, 2003, 23(6/8): 971-975.