Fabrication and Performance Simulation of Microscale Thermoelectric Modules Made with Bi2Te3-Based Alloys
Micro or nano scale thermoelectric (TE) modules have received increasing attention because of their potential applications as energy supplying and thermal managing components in microelectronic devices and micro-electro-mechanical systems (MEMS). In the present work, microscale thermoelectric modules are fabricated by combining mechanical cutting and photolithograph processes from nano-sized silicon carbide (SiC) particles reinforced Bi2Te3-based materials (Bi2Te3 for n type, and Bi0.5Sb1.5Te3 for p type) prepared by spark plasma sintering (SPS). The fabricated modules have 28 pairs of thermoelectric legs in an area of 3×3 mm2, and each of them is 200×400 µm2 in cross section and 600 µm in length, which is connected in series by Ni-Cu electrodes made with photolithograph patterning and magnetron sputtering. The thermoelectric performances of a p-n couple are simulated with the finite element method (FEM) under a thermal-electrical coupled multi-physics field for both electronic cooling (Peltier effect) and thermoelectric energy generation (Seebeck effect) working mold.
D. W. Liu and J. F. Li, "Fabrication and Performance Simulation of Microscale Thermoelectric Modules Made with Bi2Te3-Based Alloys", Key Engineering Materials, Vol. 483, pp. 75-77, 2011