Fabrication and Performance Simulation of Microscale Thermoelectric Modules Made with Bi2Te3-Based Alloys


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Micro or nano scale thermoelectric (TE) modules have received increasing attention because of their potential applications as energy supplying and thermal managing components in microelectronic devices and micro-electro-mechanical systems (MEMS). In the present work, microscale thermoelectric modules are fabricated by combining mechanical cutting and photolithograph processes from nano-sized silicon carbide (SiC) particles reinforced Bi2Te3-based materials (Bi2Te3 for n type, and Bi0.5Sb1.5Te3 for p type) prepared by spark plasma sintering (SPS). The fabricated modules have 28 pairs of thermoelectric legs in an area of 3×3 mm2, and each of them is 200×400 µm2 in cross section and 600 µm in length, which is connected in series by Ni-Cu electrodes made with photolithograph patterning and magnetron sputtering. The thermoelectric performances of a p-n couple are simulated with the finite element method (FEM) under a thermal-electrical coupled multi-physics field for both electronic cooling (Peltier effect) and thermoelectric energy generation (Seebeck effect) working mold.



Edited by:

Xiaohao Wang






D. W. Liu and J. F. Li, "Fabrication and Performance Simulation of Microscale Thermoelectric Modules Made with Bi2Te3-Based Alloys", Key Engineering Materials, Vol. 483, pp. 75-77, 2011

Online since:

June 2011




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