Slow Crack Growth and Creep Rupture of Ba0.5Sr0.5Co0.8Fe0.2O3 – δ


Article Preview

Ba0.5Sr0.5Co0.8Fe0.2O3 – δ is a mixed ion-electron conductor with high application potential as high-temperature gas separation membrane. However, in practical use the integrity of this brittle perovskite is challenged by the mechanical boundary conditions of transient temperature exposure. Moreover, long term failure mechanisms such as static fatigue at room temperature and creep rupture at operation temperature might occur. The relevance of both effects for BSCF has been investigated. The slow crack growth at room temperature has been determined using bi-axial bending under different loading rates. The creep rupture at elevated temperature has been analyzed from three-point bending tests. The results indicate favourable behaviour of BSCF in both cases. A low risk of failure due to slow crack growth exists and the strain to failure in combined tensile - compressive mode reaches up to 40 %.



Key Engineering Materials (Volumes 488-489)

Edited by:

Z. Tonković and M.H. Aliabadi






J. Malzbender et al., "Slow Crack Growth and Creep Rupture of Ba0.5Sr0.5Co0.8Fe0.2O3 – δ", Key Engineering Materials, Vols. 488-489, pp. 303-306, 2012

Online since:

September 2011




[1] M. Czyperek, P. Zapp, H. J. M. Bouwmeester, M. Modigell, K. -V. Peinemann, I. Voigt, W. A. Meulenberg, L. Singheiser and D. Stöver: Energy Procedia 1 (2009) pp.303-310.

DOI: 10.1016/j.egypro.2009.01.042

[2] J. Sunarso, S. Baumann, J. M. Serra, W. A. Meulenberg, S. Liu, Y. S. Lin and J. C. D. da Costa: J. Membrane Sci. 320 (2008) pp.13-41.

[3] A. Atkinson and T.M.G.M. Ramos: Solid State Ionics 129 (2000) 259 - 269.

[4] N. Nagabhushana, T. Nithyanantham, S. Bandopadhyay and J. Zhang: Int. J. Appl. Ceram. Technol. (2009) DOI: 10. 1111/j. 1744-7402. 2009. 02440. x.

[5] S. R. Choi, J. A. Salem and F. A. Holland: NASA Technical Memorandum 107369, (1997).

[6] J.X. Yi, H.L. Lein, T. Grande, S. Yakovlev and H.J.M. Bouwmeester: Solid State Ionics 180 (2009) pp.1564-8.

DOI: 10.1016/j.ssi.2009.09.014

[7] B. Rutkowski, J. Malzbender, T. Beck, R.W. Steinbrech and L. Singheiser: J. Europ. Ceram. Soc. 31 (2011) p.493.

[8] J.H. Kim, D.B. Han and K.T. Kim: Mater. Sci. Eng. A212 (1996) pp.87-93.

[9] C.F. Chen and T.J. Chuang: J. Am. Ceram. Soc. 73 (1990) p.2366.

In order to see related information, you need to Login.