Cu-Direct Laser Drilling of Blind Via-Hole in Multi-Layer PWBs: Process Visualization Using High-Speed Camera Images
Electrical circuits of Printed Wiring Boards (PWBs) have become multi-layered. Therefore, the formation of micro-blind holes for interlayer electrical connections (blind via holes: BVH) is required. As a result, Cu-direct laser drilling is attracting attention. However, Cu-direct drilling is problematic in that it produces a copper overhang as a result of copper and resin, which have different decomposition points, being melted simultaneously. In addition, the state of PWB surface after the laser drilling is very important. However, this procedure restricts the board density that can be achieved as a result of the limited positional accuracy of the etching process. Consequently, using a Cu-direct drilling process, which does not require etching of the copper foil, to drill BVHs to connect copper foils using a CO2 laser beam has been receiving considerable attention for the next-generation high density PWB manufacturing. However, in the Cu process of generating a direct and overhang problem, there is the problem of accuracy on the substrate surface. In contrast, in-depth research on quality companies has not been performed. Thus, we observe the removal process. Furthermore, we demonstrated reduced overhang.
W.B. Lee, C.F. Cheung and S. To
K. Obata et al., "Cu-Direct Laser Drilling of Blind Via-Hole in Multi-Layer PWBs: Process Visualization Using High-Speed Camera Images", Key Engineering Materials, Vol. 516, pp. 30-35, 2012