Performance of Wire-Sawing of Glass Assisted by Electro-Chemical Discharge
This paper deals with a combination machining method of slicing with electro-chemical discharge machining (ECDM). Glass and fine ceramics are hard to machine, and cracks are generated on their surface during cutting and grinding because of their brittleness and hardness. ECDM has been studied for machining such insulating materials. The authors have proposed a deposition method of WC layer by electrical discharge machining (EDM) with a compressed WC-Co powder as an electrode. The improvement of removal rate is expected by combining wire-sawing with ECDM. A silica glass rod was cut with a saw wire with the WC layer. The removal rate of the combination machining is larger than that of individual use of ECDM or wire sawing. The groove width by wire sawing was smaller than the others. Cracks were seldom observed on the bottom and side walls of the groove. Providing the fresh working fluid also assisted to decrease the cracks. The synergy of wire-sawing with ECDM was obtained.
Tojiro Aoyama, Hideki Aoyama, Atsushi Matsubara, Hayato Yoshioka and Libo Zhou
K. Furutani and M. Tomoto, "Performance of Wire-Sawing of Glass Assisted by Electro-Chemical Discharge", Key Engineering Materials, Vols. 523-524, pp. 299-304, 2012