A Design Method for Thin Film Patterning Process via Lift-Off Technique

Abstract:

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Thin film patterning by a lift-off method is effective from the viewpoint of cost performance and environmental issues. As a solution to the problems of conventional lift-off methods, the inversely-tapered resist profile with interstice was proposed and its fundamental feasibility was experimenatally proved. The resist profile still needed to be designed properly to solve the problems completely, and therefore a design method was also suggested. The method presupposes that conditions of deposition process have been already determined. However, actually, the conditions relate closely to the design of resist profile and wrong conditions may result in undesirable or infeasible design result. This paper proposes an integrated design method of the thin film patterning process considering design of both resist profile and deposition conditions.

Info:

Periodical:

Key Engineering Materials (Volumes 523-524)

Edited by:

Tojiro Aoyama, Hideki Aoyama, Atsushi Matsubara, Hayato Yoshioka and Libo Zhou

Pages:

787-792

Citation:

E. Morinaga et al., "A Design Method for Thin Film Patterning Process via Lift-Off Technique", Key Engineering Materials, Vols. 523-524, pp. 787-792, 2012

Online since:

November 2012

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$38.00