Optimization and Application of NTC Thick Film Segmented Thermistors


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NTC thermistor paste for printing thermal sensors on alumina was formed of very fine Ni0.5Cu0.2Zn1.0Mn1.3O4 thermistor powder obtained by a combined mechanical activation/thermal treatment process, organic vehicle and glass frit. Sheet resistivity was measured using an R-test matrix and it was much lower than the value determined for pure nickel manganite thermistors. The thermistor exponential coefficient was calculated from the R[ diagram measured in the temperature range-30 to +120°C in a climatic chamber. Thick film segmented thermistors with reduced dimensions (optimized construction) were printed sequentially layer by layer, dried and fired at 850°C/10 min in air. Electrodes were printed of PdAg conductive and solderable paste. The samples obtained were characterized by electrical and thermal measurements. The obtained NTC segmented thermistors with reduced dimensions were applied in a thermal sensor for water flow in the water mains. It contained a cold thermistor for measuring input water temperature and a self-heating thermistor for measuring the dependence of water current on water flow rate at a set input voltage power. Initial measurements show that the thermal sensor system requires a low input voltage power making it much easier and safer for operation.



Edited by:

Evangelos Hristoforou and Dr. Dimitros S. Vlachos




M. V. Nikolic et al., "Optimization and Application of NTC Thick Film Segmented Thermistors", Key Engineering Materials, Vol. 543, pp. 491-494, 2013

Online since:

March 2013




[1] S. Jagtap, S. Rane, S. Gosavi, D. Amalnerkar, Microelectron. Eng. Vol. 88 (2011) p.82.

[2] A. Feteira: J. Am. Ceram. Soc. Vol. 92 (2009), p.967.

[3] M. V. Nikolic, B. M. Radojcic, O. S. Aleksic, M. D. Lukovic, P. M. Nikolic, IEEE Sensors J. Vol. 11 (2011) p.1640.

[4] O. S. Aleksic, S. M. Savic, M. V. Nikolic, L. Sibinovski, M. D. Lukovic, Microelectron. Int. Vol. 26 (2009) p.30.

[5] O. S. Aleksic, P. M. Nikolic, K. M. Paraskevopoulos, Microelectron. Int. Vol. 23 (2006) p.14.

[6] S. Fritsch, J. Sarrias, M. Brieu, J. J. Couderc, J. L. Baudour, E. Snoeck, A. Rousset, Solid State Ionics, Vol. 109 (1998) p.229.

[7] C. H. Zhao, B. Y. Wang, P. H. Yang, L. Winnubst, C. S. Chen, J. Eur. Ceram. Soc. Vol. 28 (2008) p.35.

[8] R. Meitz, J. Mater. Sci. Vol. 35 (2000) p.4705.

[9] K. Park, J. K. Lee, Scripta Materialia, Vol. 57 (2007) p.329.

[10] J. M. Varghese, A. Seema, K. R. Dayas, J. Electroceram. Vol. 22 (2009) p.436.

[11] H. M. Zhang, A. M. Chang, C. W. Peng, Microelectron. Eng. Vol. 88 (2011) p.2934.

[12] O. S. Aleksic, B. M. Radojcic, R. M. Ramovic, Microelectron. Int. Vol. 24 (2007) p.27.