Thermal Ratcheting of Solder-Bonded Layered Plates

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The cyclic growth and recovery of warpage were observed in experiments on Si/solder/Cu layered plates subjected to cyclic thermal loading [1]. In the present study, the experiments were analyzed using representative material models for the solder and Cu layers in finite element analysis. The warpage growth/recovery behavior observed was reproduced well in the analysis using the Armstrong-Frederick and Ohno-Wang models for the solder and Cu layers, respectively. Material ratcheting due to non-proportional cyclic loading was found to happen in the solder layer as a consequence of the CTE mismatch, while material ratcheting due to proportional cyclic loading occurred in the Cu layer as a result of the significant temperature dependence of viscoplasticity in the solder layer.

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Periodical:

Edited by:

Yeong-Maw Hwang and Cho-Pei Jiang

Pages:

178-181

Citation:

N. Ohno et al., "Thermal Ratcheting of Solder-Bonded Layered Plates", Key Engineering Materials, Vol. 626, pp. 178-181, 2015

Online since:

August 2014

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$38.00

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