How Electrophoretic Deposition with Ligand-Free Platinum Nanoparticles Affects Contact Angle

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Electrophoretic deposition of ligand-free platinum nanoparticles has been studied to elucidate how wettability, indicated by contact angle measurements, is linked to vital parameters of the electrophoretic deposition process. These parameters, namely the colloid concentration, electric field strength and deposition time, have been systematically varied in order to determine their influence on the contact angle. Additionally, scanning electron microscopy has been used to confirm the homogeneity of the achieved coatings.

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Periodical:

Edited by:

A.R. Boccaccini, J.H. Dickerson, B. Ferrari, O. Van der Biest and T. Uchikoshi

Pages:

218-223

Citation:

A. Heinemann et al., "How Electrophoretic Deposition with Ligand-Free Platinum Nanoparticles Affects Contact Angle", Key Engineering Materials, Vol. 654, pp. 218-223, 2015

Online since:

July 2015

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$38.00

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