|Authors / Editors:||M.M. Al Bakri Abdullah, Z. Yahya and M.A.A. Mohd Salleh|
|Category:||Special topic volume with invited peer reviewed papers only.|
|TOC:||Table of contents|
This special issue aims to provide a high level research paper for researchers, engineers and scientists to present their new advances and research results in the field of materials and innovative technologies for mechanical engineering, construction electronic packaging.
Ceramics, Steel, Alloys, Polymers, Composites, Building Materials, Processing Technology, Electronic Packaging