Info
ISBN-13: 978-3-03835-671-4
Authors / Editors: M.M. Al Bakri Abdullah, Z. Yahya and M.A.A. Mohd Salleh
Category: Special topic volume with invited peer reviewed papers only.
Pages: 278
Year: 2016
Edition: softcover
TOC: Table of contents
  Description

This special issue aims to provide a high level research paper for researchers, engineers and scientists to present their new advances and research results in the field of materials and innovative technologies for mechanical engineering, construction electronic packaging.

Ceramics, Steel, Alloys, Polymers, Composites, Building Materials, Processing Technology, Electronic Packaging

Ringgold Subjects:
Materials Science

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978-3-03835-671-4  
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