Effect of Bonding Temperature on the Microstructure and Strength of the Joint between Magnesium AZ31 and Ti-6Al-4V Alloys Using Copper Coatings and Tin Interlayers


Article Preview

Transient Liquid Phase (TLP) bonding was performed between Mg-AZ31 and Ti-6Al-4V alloys with various bonding temperatures using Cu coatings and Sn interlayers. The bonding parameters such as bonding pressure and bonding time were fixed at 1 MPa and 15 minutes respectively in order to study the effect of bonding temperature on the joint evolution. Bonds made at temperatures of 540, 560, 580 and 600 C showed good bond strength. The obtained bonds were investigated by Electron Probe Micro-analyzer EPMA and showed reaction layers and diffusion zones for all bonds made. The maximum joint shear strength of 78 MPa was obtained for bond made at 580 C. X-ray diffraction XRD and X-ray photoelectron spectroscopy XPS were taken for the fractured surfaces of bond made at 580 C. The analysis of the fractured surfaces found that the reaction layer contains Sn5Ti6 IMC in the titanium side and Mg2Cu IMC in the magnesium side where the fracture occurs at the diffusion zone in the mg side.



Edited by:

S. Zhuiykov




A. N. AlHazaa, "Effect of Bonding Temperature on the Microstructure and Strength of the Joint between Magnesium AZ31 and Ti-6Al-4V Alloys Using Copper Coatings and Tin Interlayers", Key Engineering Materials, Vol. 735, pp. 34-41, 2017

Online since:

May 2017




* - Corresponding Author

[1] C. Blawert, N. Hort and K.U. Kainer, Trans. Indian Inst. Met., Vol. 57, 4, (2004).

[2] C. Veiga, J.P. Davim, A.J.R. Loureiro, Rev. Adv. Mater. Sci. 32, 133-148, (2012).

[3] J. L. Murray, Bulletin of Alloy Phase diagram, Vol 7, 3, 245-248, (1986).

[4] M. Hida, K. Asai, Y. Takimoto, A. Sakakibara, Materials Science forum, Vol 235, 187-192, (1996).

[5] A. Shirzadi, Microjoining and nanojoining, 234-249, (2008).

[6] X.Q. Cai, Y. Wang, Z.W. Yang, D.P. Wang, Y.C. Liu, Journal of Alloys and compounds, Vol 679, 9-17, (2016).

[7] A.N. AlHazaa, T.I. Khan, Journal of Alloys and Compounds 494 (2010) 351-358.

[8] Anas M. Atieh, Tahir I. Khan, Journal of Materials Processing Technology 214 (2014) 3158-3168.

[9] A. A. Nayeb-Hashemi, J. B. Clark, Bulletin of Alloy Phase diagram, Vol. 5, No. 5, 472-476, (1984).

[10] T. Hisaaki, H. Hideo, Symposium of the Microjoining Assembly Technology in Electronics 5 (1999) 299-304.

[11] A. N. AlHazaa, Khalil A. Khalil and Muhammad A. Shar, Journal of King Saud University‏ (Science), Volume 28, Issue 2, 152-159, (2016).

DOI: https://doi.org/10.1016/j.jksus.2015.09.006

[12] G. Liang, Z. Tang, H. Fang, D. Katz, K. Salama, Journal of Alloys and Compound 422 (2006), 73-77.

[13] A. A. Nayeb-Hashemi and J. B. Clark, The Mg-Sn (Magnesium-Tin) System, Bulletin of Alloy Phase diagrams, Vol 5 No 5 (1984).

DOI: https://doi.org/10.1007/bf02872898

[14] John Askill, T racer Diffusion Data for Metals, Alloys, and Simple Oxides, Springer, (1970).

[15] Jiahong Dai, Bin Jiang, Journal of Phase Equilibria and Diffusion Vol. 36 No. 6 (2015).

[16] J. Combronde, G. Brebec, Acta Metallurgica, Vol. 20, Jan (1972).

[17] YUAN Quan, CHEN Bin, LUO Ji, ZHANG Ding-fei, QUAN Guo-zheng, Trans. Nonferrous Met. Soc. China 20(2010) s426-s429.

DOI: https://doi.org/10.1016/s1003-6326(10)60511-0

[18] Izumi Fukudaa, Yasunori Haradab, Shunpei Ohtsuka, Procedia Engineering 81 (2014) 742-747.

[19] Byoung Ho Lee, N. S. Reddy, Jong-Taek Yeom, Chong Soo Lee, Journal of Materials Processing Technology 187: 766-769.  June (2007).

DOI: https://doi.org/10.1016/j.jmatprotec.2006.11.053