Investigation of Flux-Less Soldering of Metal Matrix Composite and Ceramics by Use of Zn Solder


Article Preview

The work was dealing with direct soldering of Al2O3 ceramics and a metal/ceramic composite (MMC) with Al matrix. The joints were fabricated by application of flux-less process by use of a hot plate at the assistance of ultrasound with frequency of 40 kHz. The experiments were performed by use of Zn6Al6Ag solder. Wetting was attained on both substrates. The joints of a good quality were fabricated. The soldering temperature was 420 °C. The microstructural studies of interface have revealed a transient zone of Al dissolving on the side of MMC and formation of Zn oxides on the side of ceramics, which were responsible for bond formation.



Edited by:

Prof. Gu Xu




R. Koleňák and I. Kostolný, "Investigation of Flux-Less Soldering of Metal Matrix Composite and Ceramics by Use of Zn Solder", Key Engineering Materials, Vol. 759, pp. 29-34, 2018

Online since:

January 2018




* - Corresponding Author

[1] LIU, C.H., KIM, Y.J., CHUN, D.W., et al. Universal solders for direct bonding and packaging of optical devices. In Materials Letters, Vol. 152, 2015, pp.232-236.

[2] SHU, M.H., HSU, B.M., HU, M.C. Optimal combination of soldering conditions of BGA for halogen-free and lead-free SMT-green processes. In Microelectronics Reliability, Vol. 52, 2012, pp.2690-2700.


[3] EL-DALY, A.A., EL-TAHER, A.M., GOUDA, S. Development of new multicomponent Sn-Ag-Cu-Bi lead-free solders for low-cost commercial electronic assembly. In Journal of Alloys and Compounds, Vol. 627, 2015, pp.268-275.


[4] XIAN, A.P., Wetting of Si-Al-O-N ceramic by Sn-5 at. % Ti-X ternary active solder. In Materials Science and Engineering B25, 1994, pp.39-46.


[5] LIU, Y.H., HU, J.D., SHEN, P., HAN, X.H., LI, J.C. Microstructural and mechanical properties of joined ZrO2/Ti-6Al-4V alloy using Ti33Zr17Cu50 amorphous brazing filler. In Materials and Design, Vol. 47, 2013, pp.281-286.


[6] DUROV, A.V., KOSTJUK, B.D., SHEVCHENKO, A.V., NAIDICH, Y.V. Joining of zirconia to metal with Cu-Ga-Ti and Cu-Sn-Pb-Ti fillers. In Materials Science and Engineering A290, 2000, pp.186-189.


[7] WU, M., CAO, C.Z., RAFI-UD-DIN, HE, X.B., QU, X.H. Brazing diamond/Cu composite to alumina using reactive Ag-Cu-Ti alloy. In Trans. Nonferrous Met. Soc. China, Vol. 23, 2013, pp.1701-1708.


[8] CHEN, X., YAN, J., REN, S., et al., Microstructure, mechanical properties, and bonding mechanism of ultrasonic-assisted brazed joints of SiC ceramics with ZnAlMg filler metals in air. In Ceramics International, Vol. 40, 2014, pp.683-689.


[9] KOLEŇÁK, R., ŠEBO, P., PROVAZNÍK, M., KOLEŇÁKOVÁ, M., ULRICH, K. Shear strength and wettability of active Sn3. 5Ag4Ti(Ce, Ga) solder on Al2O3 ceramics. In Materials and Design, Vol. 32, 2011, pp.3997-4003.


[10] CHANG, S.Y., CHUANG, T.H., YANG, C.L., Low Temperature Bonding of Alumina/Alumina and Alumina/Copper in Air Using Sn3. 5Ag4Ti(Ce, Ga) Filler. In Journal of Electronic Materials, Vol. 36, No. 9, 2007, pp.1193-1199.