A Microstructural Model for Micro-Cracking in Piezoceramics

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Piezoelectric ceramics are employed in several applications for their capability to couple mechanical and electrical fields, which can be advantageously exploited for the implementation of smart functionalities. The electromechanical coupling, which can be employed for fast accurate micro-positioning devices, makes such materials suitable for application in micro electro-mechanical systems (MEMS). However, due to their brittleness, piezoceramics can develop damage leading to initiation of micro-cracks, affecting the performance of the material in general and the micro-devices in particular. For such reasons, the development of accurate and robust numerical tools is an important asset for the design of such systems. The most popular numerical method for the analysis of micro-mechanical multi-physics problems, still in a continuum mechanics setting, is the Finite Element Method (FEM). Here we propose an alternative integral formulation for the grain-scale analysis of degradation and failure in polycrystalline piezoceramics. The formulation is developed for 3D aggregates and inter-granular failure is modelled through generalised cohesive laws.

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Edited by:

Luis Rodríguez-Tembleque, Jaime Domínguez and Ferri M.H. Aliabadi

Pages:

479-485

Citation:

I. Benedetti et al., "A Microstructural Model for Micro-Cracking in Piezoceramics", Key Engineering Materials, Vol. 774, pp. 479-485, 2018

Online since:

August 2018

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$38.00

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