Characterization of Adhesion Properties by Delamination of Ceramic-Metal Interfaces in Four Point Bending

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The adhesive strength of ceramic - copper interfaces was measured in four point bending using a central notch for crack initiation. According to our method, plastic deformation may occur during the delamination process. FEM simulations were employed in order to separate elastic and plastic contributions to the energy consumption of the experiment. In conclusion, a novel delamination criterion based on the stress intensity at the crack tip was established. Here, the stress invariant J3 is used as indicator for delamination of the interface. Agreement between experiments and theoretical interpretation is demonstrated for copper layers directly bonded to aluminum oxide.

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Edited by:

Luis Rodríguez-Tembleque, Jaime Domínguez and Ferri M.H. Aliabadi

Pages:

66-71

Citation:

M. Lederer et al., "Characterization of Adhesion Properties by Delamination of Ceramic-Metal Interfaces in Four Point Bending", Key Engineering Materials, Vol. 774, pp. 66-71, 2018

Online since:

August 2018

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$38.00

[1] Volinsky, A. A., Moody, N. R., and Gerberich, W. W. (2002), Acta Mater., 50, 441–466.

[2] Charalambides P. G., Lund J., Evans A. and McMeeking R., (1989), Journal of Applied Mechanics, 56, 77– 82.

[3] Klingbeil N. W. and Beuth J. L., (1996), Eng. Fract. Mech. 56, pp.113-126.

[4] Tuan W. H. and Lee S. K., Ceramic Transactions, Vol. 219, (2009), 9-14.

[5] Ben Kabaar A., Buttay C., Dezellus O., Estevez R., Gravouil A., Gremillard L., (2017), Microelectronics Reliability 79, pp.288-296.

DOI: https://doi.org/10.1016/j.microrel.2017.06.001

[6] Irwin G. R, (1956), Onset of fast crack propagation in high strength steels and aluminum alloys, 2nd Sagamore Ordnance Materials Conference.

[7] Rice, J. R., and Sih, G. C , (1965), ASME Journal of Applied Mechanics, 32, pp.418-423.

[8] Ottosen N. S. and Ristinmaa M., The Mechanics of Constitutive Modeling (2005), Elsevier.

[9] Khatibi G., Lederer M., Byrne A., Betzwar Kotas A., Weiss B. and Ipser H. (2013), Journal of Electronic Materials 42, pp.294-303.

[10] Lederer M., Khatibi G. and Weiss B. (2012), Int. J. Solids Structures 49, 3453-3460.

[11] Hutchinson J. W. and Suo Z., (1992), Advances in Applied Mechanics 29, p.63–89.

[12] Pape, H., Maus, I., Nabi, H. S., Ernst, L. J., Wunderle, B., and Ag, I. T., (2012), 62nd Electronic Components and Technology Conference (ECTC) p.1213–1222.

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