Grain Size Effect in High Temperature Creep and Superplastic Deformation of Polycrystalline Matrials

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Periodical:

Materials Science Forum (Volumes 189-190)

Main Theme:

Edited by:

B.C. Muddle

Pages:

335-340

DOI:

10.4028/www.scientific.net/MSF.189-190.335

Citation:

L. Shi and D. O. Northwood, "Grain Size Effect in High Temperature Creep and Superplastic Deformation of Polycrystalline Matrials", Materials Science Forum, Vols. 189-190, pp. 335-340, 1995

Online since:

July 1995

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$35.00

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