Grain Boundary Analysis in Superplastic SiO2 - Doped TZP

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Periodical:

Materials Science Forum (Volumes 233-234)

Edited by:

T. Sakuma, T. Aizawa and K. Higashi

Pages:

367-374

DOI:

10.4028/www.scientific.net/MSF.233-234.367

Citation:

P. Thavorniti et al., "Grain Boundary Analysis in Superplastic SiO2 - Doped TZP", Materials Science Forum, Vols. 233-234, pp. 367-374, 1997

Online since:

October 1996

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$35.00

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