The Development of 2in 6H-SiC Wafer with High Thermal-Conductivity

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Periodical:

Materials Science Forum (Volumes 389-393)

Edited by:

S. Yoshida, S. Nishino, H. Harima and T. Kimoto

Pages:

51-54

DOI:

10.4028/www.scientific.net/MSF.389-393.51

Citation:

Y. Miyanagi et al., "The Development of 2in 6H-SiC Wafer with High Thermal-Conductivity", Materials Science Forum, Vols. 389-393, pp. 51-54, 2002

Online since:

April 2002

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$35.00

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