Microstructure and Texture of Electrodeposited Cu on TiN Thin Films without a Cu Seed Layer

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Periodical:

Materials Science Forum (Volumes 408-412)

Edited by:

Dong Nyung Lee

Pages:

1597-1602

DOI:

10.4028/www.scientific.net/MSF.408-412.1597

Citation:

I. Kim et al., "Microstructure and Texture of Electrodeposited Cu on TiN Thin Films without a Cu Seed Layer", Materials Science Forum, Vols. 408-412, pp. 1597-1602, 2002

Online since:

August 2002

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$35.00

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