The Effect of Substrate Texture and Electroplating Conditions on the Texture and Surface Morphology of Copper Electrodeposits

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Periodical:

Materials Science Forum (Volumes 408-412)

Edited by:

Dong Nyung Lee

Pages:

1609-1614

DOI:

10.4028/www.scientific.net/MSF.408-412.1609

Citation:

J. Y. Cho and J. A. Szpunar, "The Effect of Substrate Texture and Electroplating Conditions on the Texture and Surface Morphology of Copper Electrodeposits", Materials Science Forum, Vols. 408-412, pp. 1609-1614, 2002

Online since:

August 2002

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