Processing and Properties of Cu Matrix Composites for Microelectronic Application

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Periodical:

Materials Science Forum (Volumes 426-432)

Main Theme:

Edited by:

T. Candra, Jose Maria Torralba and T. Sakai

Pages:

2199-2206

DOI:

10.4028/www.scientific.net/MSF.426-432.2199

Citation:

Y. J. Kim et al., "Processing and Properties of Cu Matrix Composites for Microelectronic Application", Materials Science Forum, Vols. 426-432, pp. 2199-2206, 2003

Online since:

August 2003

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$35.00

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