Comparison of Metal-Oxide Nanoparticle Formation in the Cu and Sn Thin Films by the Reaction with Polyimide


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We developed a simple method of producing metal oxide nanoparticles by reacting a polyamic acid (PAA) with Cu or Sn metal films. Respective particle size, distribution, and morphology were characterized by transmission electron microscopy (TEM). The morphology of metal oxides dispersed in the polyimide is different in Cu and Sn metal films. The Cu2O particles were formed by the dissolution reaction between the polyamic acid and the Cu films. During curing, PAA dehydrates and converts to polyimide, accompanied by precipitation of Cu2O particles. The synthesized Cu2O particles were randomly dispersed within the polyimide. And their particle size was relatively uniform, having a narrow distribution. Mostly nanosize Cu2O particles were formed in the specimen made from 10 nm thick Cu film and the mixture of nanosize particles and Cu layers were observed in the 30 nm thick Cu film. On the other hands, the Sn film undergoes surface reaction with the polyamic acid. Therefore, the synthesized SnO2 particles existed only at the surface of the substrate. SnO2 particle size distribution was not uniform in the polyimide. Although particles were not distributed uniformly in the polyimide, they were confined in a monolayer. The different particle distributions were attributed to the reactivity difference of PAA with Cu and Sn films.



Materials Science Forum (Volumes 449-452)

Edited by:

S.-G. Kang and T. Kobayashi




H. P. Park et al., "Comparison of Metal-Oxide Nanoparticle Formation in the Cu and Sn Thin Films by the Reaction with Polyimide", Materials Science Forum, Vols. 449-452, pp. 1237-1240, 2004

Online since:

March 2004




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