Influence of Shear Speed on the Shear Force of Eutectic Sn-Pb and Pb-Free BGA Solder Joints

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The experimental investigation and non-linear finite element analysis using elastic-viscoplastic constitutive model were conducted to study the effect of ball shear speed on shear force of BGA solder joints. The Ag3Sn intermetallic compound (IMC) particles were found inside the Sn-3.5Ag solder, while the fine intermixed structure of lead-rich phases and tin-rich phases was investigated inside the eutectic Sn-37Pb solder. The shear force linearly increased with shear speed and reached to the maximum value at the highest shear speed in both experimental and computational results. All of the test specimens were fractured like ductile mode, and the plastic strain energy density distributions were deeply related to the failure mechanism.

Info:

Periodical:

Materials Science Forum (Volumes 449-452)

Edited by:

S.-G. Kang and T. Kobayashi

Pages:

897-900

DOI:

10.4028/www.scientific.net/MSF.449-452.897

Citation:

J. W. Kim et al., "Influence of Shear Speed on the Shear Force of Eutectic Sn-Pb and Pb-Free BGA Solder Joints ", Materials Science Forum, Vols. 449-452, pp. 897-900, 2004

Online since:

March 2004

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Price:

$35.00

[1] Ken Gilleo: Area Array Packaging Handbook (McGraw-Hill, New York 2002).

[2] S.W. Ricky Lee, Xingjia Huang: Soldering & Surface Mount Technology Vol. 14 (2002), p.45.

[3] JESD 22-B117, JEDEC Solid State Technology Association (2000).

[4] L. Anand: J. Plasticity Vol. 1 (1985), p.213.

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