Recrystallization Mechanisms in Wire-Drawn Copper
Wire-drawn Electrolytic Tough Pitch copper deformed at moderate strain has been investigated with Electron Back Scattered Diffraction in a Scanning Electronic Microscope in order to evaluate the recrystallization mechanisms at the meso-scale. Experimentally, it has been shown that the static recrystallization takes place first in the highly deformed and misoriented areas, in the intermediate regions of the wire. The grains related to the <100> fiber nucleate and grow first in these regions, but some other orientations (including the <111> oriented grains) - that have a combined nucleation/growth potential - develop in second time. The annealing twinning is active from the beginning of the recrystallization and tends to randomize the final recrystallization texture.
B. Bacroix, J.H. Driver, R. Le Gall, Cl. Maurice, R. Penelle, H. Réglé and L. Tabourot
P. Gerber et al., "Recrystallization Mechanisms in Wire-Drawn Copper", Materials Science Forum, Vols. 467-470, pp. 135-140, 2004