Study of Deformation Microstructure and Static Recovery in Copper after Cold Drawing

Abstract:

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The analysis of the microstructure deformation and the static recovery were investigated by transmission electron microscopy (TEM) observations, after cold drawing in copper. The observed microstructures according to the orientation of grains are composed of dislocation cells, deformation bands and dense dislocation walls. In <001> grains, the cells are equiaxed, regular and surrounded by sharp walls, whereas in the <111> grains the cell creation is also in progress. During the annealing, the microstructure of <001> grains evolves to a stable configuration composed of very thin walls and coalesced cells that correspond to the first recrystallization nuclei.

Info:

Periodical:

Materials Science Forum (Volumes 467-470)

Edited by:

B. Bacroix, J.H. Driver, R. Le Gall, Cl. Maurice, R. Penelle, H. Réglé and L. Tabourot

Pages:

27-32

DOI:

10.4028/www.scientific.net/MSF.467-470.27

Citation:

M. Benyoucef et al., "Study of Deformation Microstructure and Static Recovery in Copper after Cold Drawing", Materials Science Forum, Vols. 467-470, pp. 27-32, 2004

Online since:

October 2004

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Price:

$35.00

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