Study on the Cure Kinetics of Middle Temperature Curing 3234 Epoxy Resin System

Abstract:

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The cure kinetics of middle temperature curing 3234 epoxy resin was investigated under both isothermal and dynamic curing conditions by Differential Scanning Calorimetry (DSC) technique. The kinetic equations for isothermal and dynamic curing were established respectively by analyzing experimental data obtained from DSC . By following the temperature procedure of the standard cure cycle of the resin system, the validity of the cure kinetic equations was verified by means of determining the residual heat of reaction of samples from different stages of the cure cycle. Results showed that the cure kinetics under both isothermal and dynamic conditions could be described by the autocatalytic kinetic model. Predictions by the kinetic equation for dynamic curing agreed well with the experimental results.

Info:

Periodical:

Materials Science Forum (Volumes 475-479)

Main Theme:

Edited by:

Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie

Pages:

1041-1044

DOI:

10.4028/www.scientific.net/MSF.475-479.1041

Citation:

T. S. Liu et al., "Study on the Cure Kinetics of Middle Temperature Curing 3234 Epoxy Resin System", Materials Science Forum, Vols. 475-479, pp. 1041-1044, 2005

Online since:

January 2005

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Price:

$35.00

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