Preparation and Sintering Behavior of Au Conductor Pastes for LTCC Substrate

Abstract:

Article Preview

Fine Au powders with spherical morphology and good dispersivity were produced. The average particle size is 1~2m. The influences of constituents on the rheology of organic vehicles were investigated by orthogonal design method. Consequently, the compatible Au thick film pastes for LTCC substrate have been prepared. SEM was carried out to study the sintering behaviors and microstructures of the buried pastes with LTCC substrate. These pastes have high electrical conductivity (less than 3m/sq.), reliable wire bond strength (greater than 9 grams, 25m Au wire) and fine line printability (as small as 80m). The via filling technology was also discussed in this paper.

Info:

Periodical:

Materials Science Forum (Volumes 475-479)

Main Theme:

Edited by:

Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie

Pages:

1763-1766

Citation:

Y. Wang et al., "Preparation and Sintering Behavior of Au Conductor Pastes for LTCC Substrate", Materials Science Forum, Vols. 475-479, pp. 1763-1766, 2005

Online since:

January 2005

Export:

Price:

$38.00

[1] S. Vasudevan, A. Shaikh: Proceedings of the 44th Electronic Components and Technology Conference (1994), p.612.

[2] Rao R. Tummala, Eugene J. Rymaszewski, et. al: Microelectronics Packaging Handbook (International Thomson Publishing, America, 1997), p. II-91.

DOI: https://doi.org/10.1007/978-1-4615-4086-1

[3] William D. Brown : Advanced Electronic Packaging (the institute of electrical and electronic Engineers, Inc., 1999), p.28.

[4] Glenn R. Blackwell: The Electronic Packaging Handbook (IEEE Press, 2000), pp.7-3.

[5] Yonggang Wang, Guangneng Zhang, Jusheng Ma: Materials Sci. and Eng. A337, (2002), pp.247-280.

[6] John R. Larry, Richard M. Rosenberg, et. al: Transaction on Components, Hybrids, and Manufacturing Technology Vol. CHMT-3 (1980), P. 224 Fig. 3 (a) Mismatch and (b)match of inner conductor in LTCC substrate Fig. 4 Filled via in substrate.

Fetching data from Crossref.
This may take some time to load.