Intermetallic Formation between Sn-Ag(-Cu) Solder Bumps and Au/Ni/Ti UBM and It’s Effects on the Shear Force of the Solder Bumps

Abstract:

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The shear force of Sn-3.5Ag and Sn-3.8Ag-0.7Cu solder bumps formed by the stencil printing method was measured and the effects of intermetallic formation on the shear force of solder bumps were investigated. The Sn-Ag(-Cu) solder paste was printed on the Au/Ni/Ti under bump metallurgy (UBM) and then reflowed repeatedly. The shear force of the solder bumps was measured as a function of the reflow times. The intermetallic formation in the Sn-Ag(-Cu) solder/UBM was characterized using scanning electron microscopy (SEM), energy dispersive x-ray spectroscopy (EDS) and x-ray diffractormeter. Ni3Sn4 phase was formed in the Sn-3.5Ag solder/UBM interface and (Cu,Ni)6Sn5 phase formed at the Sn-3.8Sg-0.7Cu solder/UBM interface. The shear force of solder bumps was sensitive to the depletion of Ni layer and the intermetallic thickness at the solder/Ni interface. The shear forces of Sn-3.5Ag solder bumps decreased rapidly after the fifth reflow due to the depletion of Ni layer in the UBM. The shear forces of Sn-3.8Ag-0.7Cu solder bumps decreased after the tenth reflow due to extensive growth of intermetallic layer in the solder/Ni interface.

Info:

Periodical:

Materials Science Forum (Volumes 475-479)

Main Theme:

Edited by:

Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie

Pages:

1881-1884

DOI:

10.4028/www.scientific.net/MSF.475-479.1881

Citation:

S. H. Park and Y. H. Kim, "Intermetallic Formation between Sn-Ag(-Cu) Solder Bumps and Au/Ni/Ti UBM and It’s Effects on the Shear Force of the Solder Bumps", Materials Science Forum, Vols. 475-479, pp. 1881-1884, 2005

Online since:

January 2005

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$35.00

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