Directional Solidification of Undercooled Hypoeutectic Silver-Copper Alloy Melt

Abstract:

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Directional solidification of the undercooled melt which combines melt undercooling with conventional directional solidification is a new method of obtaining directional structure. This method is used to realize the directional solidification of the undercooled Ag70.3Cu29.7 melt. The experiment is performed in two steps: The undercooled melt is obtained by glass fluxing, and the above specimen is remelted and excited with Ga-In-Sn coolant. By this method, directional solidification dendrites of Ag70.3Cu29.7 alloy are achieved successfully. The columnar dendrites are straight and fine. The primary arm spacing is 21µm in average for a 65K undercooling, as compared to 38µm for a 32K undercooling. This confirms that higher undercooling promotes finer dendritic microstructures.

Info:

Periodical:

Materials Science Forum (Volumes 475-479)

Main Theme:

Edited by:

Z.Y. Zhong, H. Saka, T.H. Kim, E.A. Holm, Y.F. Han and X.S. Xie

Pages:

2607-2610

DOI:

10.4028/www.scientific.net/MSF.475-479.2607

Citation:

Y. Y. Lu et al., "Directional Solidification of Undercooled Hypoeutectic Silver-Copper Alloy Melt", Materials Science Forum, Vols. 475-479, pp. 2607-2610, 2005

Online since:

January 2005

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Price:

$35.00

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