Processing and Microstructural Characteristics of Bi-Materials Composed of Al and Its Composite


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Both the Al-5wt%Mg powder mixture and Al-5wt%Mg/SiCp composite mixture were separately ball-milled for 50h, followed by compaction under a pressure of 350MPa. To obtain the bi-materials, the compacted Al-5wt%Mg and Al-5wt%Mg/SiCp composites were bonded by sintering at 873K-1173K for 1-3h. At a relatively low temperature, 873K, the sound bi-materials could not be obtained. However, the bi-materials with the macroscopically bonded interface between Al-Mg and its composite were obtained at temperatures higher than 873K. The length of a well-bonded interface became longer with increasing temperature and time, indicating the improved contact in the bonded interface. The relative density in the bi-materials increased as the sintering temperature and time increased, and the bi-materials sintered at 1173K for 5h showed the highest density.



Materials Science Forum (Volumes 486-487)

Edited by:

Hyung Sun Kim, Sang-Yeop Park, Bo Young Hur and Soo Wohn Lee




S. Y. Chang et al., "Processing and Microstructural Characteristics of Bi-Materials Composed of Al and Its Composite", Materials Science Forum, Vols. 486-487, pp. 362-365, 2005

Online since:

June 2005




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[2] [4] [6] [8] [10] [5] [3] [1] Length (mm) Sintering Time, t / h Sitered at 700 Sitered at 800 Sitered at 900 as-compacted 1 3 5.

[80] [85] [90] [95] 100 Relative Density (%) Sintering Time, t / h Sintered at 700 oC Sintered at 800 oC Sintered at 900 oC.