Compressive Behavior of Extruded SiCw/AZ91 at Temperatures close to and above the Solidus of the Matrix Alloy
Compressive deformation behaviors of extruded SiCw/AZ91 were investigated in Gleeble-1500 thermal simulator at temperatures from 743 K to 783 K and strain rates from 6.4×10-2 s-1 to 1.0×101s-1. Results showed that high strain rate sensitivity (~0.5) occurred during compression; deformation activation energy normalized by threshold stress was higher than the lattice self-diffusion activation energy of magnesium. Dynamic recovery (DRV) and dynamic recrystallization (DRX) took place during compression, which refined the grains. The increase of deformation energy was attributed to non-basal planes slip and climbing of dislocations and also the presence of liquid phase.
W.Ke, E.H.Han, Y.F.Han, K.Kainer and A.A.Luo
W. M. Gan et al., "Compressive Behavior of Extruded SiCw/AZ91 at Temperatures close to and above the Solidus of the Matrix Alloy", Materials Science Forum, Vols. 488-489, pp. 827-830, 2005