The present paper investigates the creep phenomenon of the functionally graded materials under high temperature environment by the computational micromechanical method (CMM). Based on the real microstructure of the functionally graded interlayer with different component volume fractions, the emulation experiment is implemented for the creep test numerically and the creep parameters are obtained. A further series of simulation works are carried out to investigate the creep phenomenon of FGM interlayers in more detail. Numerical results show that the creep phenomenon is obvious not only for the metal-rich interlayers but also for the ceramic-rich interlayers. The creep property of ceramic/metal interlayer depends on the material’s properties of the ceramic obviously. It is remarkable that the creep strain rate of the ceramic/metal interlayer is larger than the corresponding one of pure metal under the same load when the modulus of the ceramic component is lower than the one of the metal component.