Textural and Microstructural Inhomogeneities in Drawn and Annealed OFHC Copper Wire
This work presents the results of a study on textural and microstructural inhomogeneities that develop during annealing of heavily drawn Oxygen free high conducting (OFHC) copper wire. The wire was drawn at room temperature to a true strain of 2.31 and isothermally annealed at 750°C for annealing times ranging from 10s to 1hr. The inhomogeneity of microstructure across the wire was clearly visible as three distinct concentric regions, which were classified as: the inner core, the mid section, and the outer surface. Two texture transitions were observed. At shorter annealing time, recrystallization which originated from the mid section, resulted into a strong<100>+weak<111> duplex fiber texture. However, prolonged annealing gave rise to abnormal grain-growth that proceed from the mid section to the outer surfaces with a dominant <111> fiber component at the mid and inner region, and mixed components of <111>, <100>, and <112> at the outer surfaces.
Paul Van Houtte and Leo Kestens
D. R. Waryoba and P. N. Kalu, "Textural and Microstructural Inhomogeneities in Drawn and Annealed OFHC Copper Wire ", Materials Science Forum, Vols. 495-497, pp. 895-900, 2005