Textural and Microstructural Inhomogeneities in Drawn and Annealed OFHC Copper Wire

Abstract:

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This work presents the results of a study on textural and microstructural inhomogeneities that develop during annealing of heavily drawn Oxygen free high conducting (OFHC) copper wire. The wire was drawn at room temperature to a true strain of 2.31 and isothermally annealed at 750°C for annealing times ranging from 10s to 1hr. The inhomogeneity of microstructure across the wire was clearly visible as three distinct concentric regions, which were classified as: the inner core, the mid section, and the outer surface. Two texture transitions were observed. At shorter annealing time, recrystallization which originated from the mid section, resulted into a strong<100>+weak<111> duplex fiber texture. However, prolonged annealing gave rise to abnormal grain-growth that proceed from the mid section to the outer surfaces with a dominant <111> fiber component at the mid and inner region, and mixed components of <111>, <100>, and <112> at the outer surfaces.

Info:

Periodical:

Materials Science Forum (Volumes 495-497)

Edited by:

Paul Van Houtte and Leo Kestens

Pages:

895-900

DOI:

10.4028/www.scientific.net/MSF.495-497.895

Citation:

D. R. Waryoba and P. N. Kalu, "Textural and Microstructural Inhomogeneities in Drawn and Annealed OFHC Copper Wire ", Materials Science Forum, Vols. 495-497, pp. 895-900, 2005

Online since:

September 2005

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Price:

$35.00

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