Segregation Profiles in Diffusion Soldered Ni/Al/Ni Interconnections

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An Al foil of 25 µm thickness was used to produce a Ni/Al/Ni interconnection under isothermal conditions at 680°C. After dissolution of the Al filler metal in the Ni substrate, and Ni from the substrate in the Al liquid foil, a solidification process occurred. First of all, the solidification was stopped just at the disappearance of the Al liquid metal, but also at different steps of the progress of solidification. Sub-layers of the two phases Al3Ni2 and Al3Ni were revealed within the frozen joints. A solidification - segregation model was developed to describe the formation of the sub-layers of both mentioned phases. The model is able to predict solute segregation profiles across the sub-layers of the Ni/Al/Ni interconnection, taking into account a superposition of some phenomena like partitioning, back-diffusion into the solid and peritectic reactions. The value of the diffusion coefficient into the solid for the Al3Ni2 phase formation in the presence of the liquid is also estimated.

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Periodical:

Edited by:

A Roósz, M. Rettenmayr and Z. Gácsi

Pages:

385-392

DOI:

10.4028/www.scientific.net/MSF.508.385

Citation:

W. Wołczyński et al., "Segregation Profiles in Diffusion Soldered Ni/Al/Ni Interconnections", Materials Science Forum, Vol. 508, pp. 385-392, 2006

Online since:

March 2006

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$35.00

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