Reliability of Sn-Ag-Cu Flip Chip Package with Underfill under Thermal Shock

Abstract:

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Thermal fatigue properties of solder joints encapsulated with underfill were studied conducting thermal shock tests. Flip chip package with electroless nickel-immersion gold plated on FR-4 substrate and the Sn-3.0Ag-0.5Cu solder ball was used. The fatigue property of package with underfill was better than the package without it. The fatigue property of package with underfill which has a higher glass transition temperature (Tg) and lower coefficient of thermal expansion (CTE) was better than that of package with underfill with lower Tg and higher CTE.

Info:

Periodical:

Materials Science Forum (Volumes 510-511)

Edited by:

Hyung Sun Kim, Yu Bao Li and Soo Wohn Lee

Pages:

558-561

DOI:

10.4028/www.scientific.net/MSF.510-511.558

Citation:

B. I. Noh and S. B. Jung, "Reliability of Sn-Ag-Cu Flip Chip Package with Underfill under Thermal Shock", Materials Science Forum, Vols. 510-511, pp. 558-561, 2006

Online since:

March 2006

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Price:

$35.00

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