Reliability of Sn-Ag-Cu Flip Chip Package with Underfill under Thermal Shock
Thermal fatigue properties of solder joints encapsulated with underfill were studied conducting thermal shock tests. Flip chip package with electroless nickel-immersion gold plated on FR-4 substrate and the Sn-3.0Ag-0.5Cu solder ball was used. The fatigue property of package with underfill was better than the package without it. The fatigue property of package with underfill which has a higher glass transition temperature (Tg) and lower coefficient of thermal expansion (CTE) was better than that of package with underfill with lower Tg and higher CTE.
Hyung Sun Kim, Yu Bao Li and Soo Wohn Lee
B. I. Noh and S. B. Jung, "Reliability of Sn-Ag-Cu Flip Chip Package with Underfill under Thermal Shock", Materials Science Forum, Vols. 510-511, pp. 558-561, 2006