Joining of TiAl Using a Thin Multilayer

Abstract:

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As TiAl based alloys begin to approach maturity, the development of successful and cost effective joining methods will be required. The growing industrial interest in these materials, particularly in aerospace and automotive industry, led to an interesting challenge - how to joint parts and components in order to produce integrated and resistant structures. Diffusion bonding of materials produces components with thinner interfaces than other joining techniques do. The absence of abrupt microstructure discontinuity and the small deformation induced maximize joint strength. This work focuses on the joining of TiAl using a thin multilayer obtained by alternating nanometric layers of titanium and aluminium. The Ti/Al layers were deposited onto the γ-TiAl samples by DC magnetron sputtering. The interfaces of these diffusion bonded joints depend on processing and deposition conditions. In this work we describe the influence of bilayer thickness (period) and on microstructure and chemical composition of the joining interfaces.

Info:

Periodical:

Materials Science Forum (Volumes 514-516)

Edited by:

Paula Maria Vilarinho

Pages:

1323-1327

DOI:

10.4028/www.scientific.net/MSF.514-516.1323

Citation:

L. I. Duarte et al., "Joining of TiAl Using a Thin Multilayer", Materials Science Forum, Vols. 514-516, pp. 1323-1327, 2006

Online since:

May 2006

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Price:

$35.00

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