Thermoelectric Properties of Bi2Te3/Sb2Te3 Thin Films

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The deposition and characterization of n-type Bi2Te3 and p-type Sb2Te3 semiconductor films are reported. The films were deposited by thermal co-evaporation on a 25 µm thick polyimide (kapton) substrate. The co-evaporation method is inexpensive, simple, and reliable, when compared to other techniques that need longer time periods to prepare the starting material or require more complicated and expensive deposition equipment. Seebeck coefficients of -189 µVK-1 and +140 µVK-1 and electrical resistivities of 7.7 µ0m and 15.1 µ0m were measured at room temperature on n-type and p-type films, respectively. These values are better than those reported for films deposited by co-sputtering or electrochemical deposition, and are close to those reported for films deposited by metal-organic chemical vapour deposition or flash evaporation. Because of their high figures of merit, these films will be used for the fabrication of a micro-Peltier element, useful in temperature control and laser-cooling for telecommunications.

Info:

Periodical:

Materials Science Forum (Volumes 514-516)

Edited by:

Paula Maria Vilarinho

Pages:

156-160

DOI:

10.4028/www.scientific.net/MSF.514-516.156

Citation:

L. M. Gonçalves et al., "Thermoelectric Properties of Bi2Te3/Sb2Te3 Thin Films", Materials Science Forum, Vols. 514-516, pp. 156-160, 2006

Online since:

May 2006

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Price:

$35.00

[1] D.M. Rowe, CRC Handbook of Thermoelectrics, CRC Press, (1995).

[2] R. Venkatasubramanian, E. Siivola, T. Colpitts, and B. O'Quinn, Thin-film thermoelectric devices with high room-temperature figures of merit, Nature, vol. 413, 6856, 597, (2001).

DOI: 10.1038/35098012

[3] Helin Zou, D.M. Rowe, S.G.K. Williams, Peltier effect in a co-evaporated Sb2Te3(P)Bi2Te3(N) thin film thermocouple, Thin Solid Films, 408, 270, (2002).

DOI: 10.1016/s0040-6090(02)00077-9

[4] Harald Böttner, Joachim Nurnus, Alexander Gavrikov, Gerd Kühner, Martin Jägle, Christa Künzel, Dietmar Eberhard, Gerd Plescher, Axel Schubert, and Karl-Heinz Schlereth, New Thermoelectric Components Using Microsystem Technologies, Journal of Microelectromechanical Systems, 3, 414, (2004).

DOI: 10.1109/jmems.2004.828740

[5] J.R. Lim, G.J. Snyder, C.K. Huang, J.A. Herman, MA. Ryanand, J.P. Fleurial, Thermoelectric Microdevice Fabrication Process and Evaluation at the Jet Propulsion Laboratory, ICT2002.

DOI: 10.1109/ict.2002.1190373

[6] A. Giani, A. Boulouz, F. Pascal-Delannoy, A. Foucaran, E. Charles, A. Boyer, Growth of Bi2Te3 and Sb2Te3 thin films by MOCVD, Materials Science and Engineering, B64, 19-24, (1999).

DOI: 10.1016/s0921-5107(99)00142-7

[7] A. Foucaran, Flash evaporated layers of (Bi2Te3-Bi2Se3)(N) and (Bi2Te3-Sb2Te3)(P), Materials Science and Engineering, B52, 154-161, (1998).

DOI: 10.1016/s0921-5107(98)00108-1

[8] Luciana W. da Silva and Massoud Kaviany, Miniaturized Thermoelectric Cooler, " IMECE, 02.

DOI: 10.1115/imece2002-32437

[9] Gao Min, D.M. Rowe, Cooling performance of integrated thermoelectric Microcooler, SolidState Electronics, 43, 923-929, (1999).

DOI: 10.1016/s0038-1101(99)00045-3

[10] J.P. Holman, Heat Transfer, Mc Graw Hill, (1989).

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