Optimization of Deformable-Adhesive Application on the Chip-Apply Process


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A study on the impact of batch-to-batch variability of a commercial wet adhesive on its plastic deformation behaviour is here presented. In the chip-apply process, a controlled and stable plastic deformation under thermal-mechanical compression is expected after the first of a two-step curing, named pre-cure. Wet adhesive batches rheological, mechanical and chemical characteristics are available but no information on deformation behaviour is provided. Different pre-curing recipes and oven atmospheres were tested and the plastic deformation was induced by applying pre-defined thermo-compression parameters. Results indicate that shorter pre-cure cycles at higher temperature, under air atmosphere, reduce batch-to-batch deformation variability. DSC curves support these findings. A correlation between deformation level and rheological properties could also be observed, which can be very useful in the triage of adhesive batches for specific process parameters window.



Materials Science Forum (Volumes 514-516)

Edited by:

Paula Maria Vilarinho




I. Macedo et al., "Optimization of Deformable-Adhesive Application on the Chip-Apply Process", Materials Science Forum, Vols. 514-516, pp. 848-852, 2006

Online since:

May 2006




[1] F. N. Sinnadurai, Handbook of Microelectronics Packaging and Interconnection Technologies, Electrochemical Publications Limited, Scotland (1985).

[2] Eugene R. Hnatek, Integrated Circuit Quality and Reliability. Marcel Dekker Inc, New York (1995).