Optimization of Deformable-Adhesive Application on the Chip-Apply Process

Abstract:

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A study on the impact of batch-to-batch variability of a commercial wet adhesive on its plastic deformation behaviour is here presented. In the chip-apply process, a controlled and stable plastic deformation under thermal-mechanical compression is expected after the first of a two-step curing, named pre-cure. Wet adhesive batches rheological, mechanical and chemical characteristics are available but no information on deformation behaviour is provided. Different pre-curing recipes and oven atmospheres were tested and the plastic deformation was induced by applying pre-defined thermo-compression parameters. Results indicate that shorter pre-cure cycles at higher temperature, under air atmosphere, reduce batch-to-batch deformation variability. DSC curves support these findings. A correlation between deformation level and rheological properties could also be observed, which can be very useful in the triage of adhesive batches for specific process parameters window.

Info:

Periodical:

Materials Science Forum (Volumes 514-516)

Edited by:

Paula Maria Vilarinho

Pages:

848-852

DOI:

10.4028/www.scientific.net/MSF.514-516.848

Citation:

I. Macedo et al., "Optimization of Deformable-Adhesive Application on the Chip-Apply Process", Materials Science Forum, Vols. 514-516, pp. 848-852, 2006

Online since:

May 2006

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Price:

$35.00

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